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Description
Currently, bed leveling routines always run at 60°C, which is suboptimal for various bed surfaces and filament types. The temperature is currently hardcoded in the Elegoo firmware and cannot be set by users through configuration or G-code.
Proposal:
- Make the bed leveling temperature configurable in the OpenCentauri firmware so that it can be set via:
- G-code parameter (e. g.
BED_LEVEL_TEMP S{temperature}) - Slicer profile (uses already-heated bed temperature)
- Configuration file (configurable default if no parameter is given)
- G-code parameter (e. g.
- This would allow users to perform heated bed leveling at an optimal temperature for their material and bed surface, which may be lower or higher than 60°C.
Background:
- On many printers, heated bed leveling is recommended, but the optimal temperature depends on the material, adhesive, and process.
- Currently, the process is not flexible and can lead to unintentional warping or risk of reduced adhesive performance.
Request:
Please implement the ability to set the bed leveling temperature, either via a config file or a G-code argument. Ideally, default to a sensible value (e.g. 60°C), but allow override/parameterization.
References:
- Issues and discussion threads among users requesting this feature
- Need for flexibility for different printers, beds, and filaments
Jeisecke, 2026-01-11
badm235, Jeisecke and gruiz4
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